PCI will be present at the International Trade Fair for Grinding Technology, GRINDTEC in March 2020. We will exhibit our eSpindle, the one and only technology for smart processes, seen at the EMO Hannover 2019 but also our honing with machining center technology.
As a reminder : PCI developed the eSpindle technology in collaboration with France’s Technical Centre for Mechanical Industry and the French Arts et Métiers engineering and research graduate school. This technology uses sensors and actuators to monitor cutting processes and adjust parameters.
But the eSpindle will not be the only innovation present at GrindTec 2020 ! We will show you our offer concerning a complete machining process to go over finishing operations of cylinders blocks on standards horizontal CNC machines. You will know more if you come see us… !
We are looking forward to meet you on our booth in Hall 7 Stand 7010 from Wednesday 18th to Saturday 21st March 2020 at Messe Augsburg.